Kingmax affiliate to expand CMOS image sensor packaging capacity

Backend service provider Kingpak Technology, a member of the Kingmax Group, has set a goal to expand its monthly capacity for CMOS image sensor (CIS) packaging and testing from 2-3 million units to the four million mark, according to the company. Sales from the CIS packaging segment account for 60-70% of Kingpak's total revenues at present, said the company.

Less concentration on memory packaging is intended to improve Kingpak's gross margin, a response to falling ASPs, the company noted. Applications for CIS packaging include notebook-use integrated cameras and camera-equipped mobile phones, which require advanced technology to meet rising demand in the 3G audio-visual market.

Kingpak mainly supplies memory packaging for DRAM modules to Kingmax Semiconductor. For the non-DRAM segment, Silicon Storage Technology (SST) and Etron Technology are the company's major clients, according to company sources. For CIS applications, Kingpak's customers include Micron Technology, Logitech, Chicony Electronics, KYE Systems and Quanta Computer, the sources indicated.