IC substrate maker Kinsus sees growing demand from handset segment

Kinsus Interconnect Technology expects first-quarter revenues to have only a slight drop sequentially despite fewer working days, as demand from handset chip customers has picked up.

Kinsus expects to see the revenue share of flip-chip chip-scale packaging (FC-CSP) substrates increase to 23-25% in the first quarter from 14% in the fourth quarter of 2009. The company supplies FC CSP substrates mainly to first-tier handset chip makers and has 30-40% share of the FC CSP market, according to industry sources.

Kinsus' IC substrate products account for about 35% of its total revenues.

The company also expects growth for its bismaleimide triazine (BT)-based substrates in 2010, buoyed by China's deployment of 3G handset base stations.