Qualcomm Premieres Snapdragon, First Chipset Solutions to Break the Gigahertz Barrier with Multi-mode Broadband and Multimedia Features
Company Showcases First Two Products from Snapdragon Family for Next Generation Mobile Computing at New York Analyst Meeting Today
SAN DIEGO — Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced that it is delivering the first groundbreaking chipset products from the Snapdragon™ platform to numerous device manufacturers. The QSD8250™ and QSD8650™ are now shipping to customers worldwide, offering an unprecedented combination of mobile data processing, multimedia performance, 3G wireless connectivity and the lowest levels of power consumption for all-day battery life.
The Company will be demonstrating the Snapdragon platform running both Windows Mobile and Linux to deliver productivity applications, entertainment applications and advanced user experiences at Qualcomm's New York Analyst Meeting.
“HTC and Qualcomm have been working together for many years on raising the bar for the mobile market, pushing forward on delivering new capabilities and a better user experience,” said Peter Chou, president and CEO, HTC Corporation. “We are happy to be working together with Qualcomm on this groundbreaking new Snapdragon solution, which will bring a new era of fully featured, customizable user experiences to consumers around the world.”
“As we expand from the traditional wireless handset market, Qualcomm's Snapdragon platform will be the catalyst for a new era of innovative computing and consumer wireless mobile devices,” said Dr. Sanjay K. Jha, president of Qualcomm CDMA Technologies. “The enthusiastic reception from leading electronics customers for our versatile gigahertz Snapdragon chipset heralds new possibilities for products blending the mobile phone, 3G wireless connectivity and computing capabilities with unsurpassed battery life.”
The QSD8250 supports HSPA data rates of up to 7.2 Mbps on the downlink and 5.76 on the uplink, with full backward compatibility. The dual-mode QSD8650 supports HSPA, as well as CDMA2000® 1xEV-DO Rev. B, with full backward compatibility. The two solutions feature a custom gigahertz microprocessor core paired with Qualcomm's sixth-generation DSP core running at 600 MHz for unsurpassed mobile performance delivering an instant-on and always-connected user experience.
Snapdragon's support for HD video decode, 12 megapixel camera, GPS, broadcast TV (using MediaFLO, DVBH-H and/or ISDB-T), Wi-Fi and Bluetooth deliver even greater opportunities for device manufacturers to design compelling mobile products that make the promise of constant, seamless connectivity in an extremely thin and small form-factor a reality.
For more information on Snapdragon, please visit: www.cdmatech.com/snapdragon
Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2007 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of Snapdragon-based components on a timely and profitable basis, the extent and speed to which QSD8250 and QSD8650 products are deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 30, 2007, and most recent Form 10-Q.
SAN DIEGO — Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced that it is delivering the first groundbreaking chipset products from the Snapdragon™ platform to numerous device manufacturers. The QSD8250™ and QSD8650™ are now shipping to customers worldwide, offering an unprecedented combination of mobile data processing, multimedia performance, 3G wireless connectivity and the lowest levels of power consumption for all-day battery life.
The Company will be demonstrating the Snapdragon platform running both Windows Mobile and Linux to deliver productivity applications, entertainment applications and advanced user experiences at Qualcomm's New York Analyst Meeting.
“HTC and Qualcomm have been working together for many years on raising the bar for the mobile market, pushing forward on delivering new capabilities and a better user experience,” said Peter Chou, president and CEO, HTC Corporation. “We are happy to be working together with Qualcomm on this groundbreaking new Snapdragon solution, which will bring a new era of fully featured, customizable user experiences to consumers around the world.”
“As we expand from the traditional wireless handset market, Qualcomm's Snapdragon platform will be the catalyst for a new era of innovative computing and consumer wireless mobile devices,” said Dr. Sanjay K. Jha, president of Qualcomm CDMA Technologies. “The enthusiastic reception from leading electronics customers for our versatile gigahertz Snapdragon chipset heralds new possibilities for products blending the mobile phone, 3G wireless connectivity and computing capabilities with unsurpassed battery life.”
The QSD8250 supports HSPA data rates of up to 7.2 Mbps on the downlink and 5.76 on the uplink, with full backward compatibility. The dual-mode QSD8650 supports HSPA, as well as CDMA2000® 1xEV-DO Rev. B, with full backward compatibility. The two solutions feature a custom gigahertz microprocessor core paired with Qualcomm's sixth-generation DSP core running at 600 MHz for unsurpassed mobile performance delivering an instant-on and always-connected user experience.
Snapdragon's support for HD video decode, 12 megapixel camera, GPS, broadcast TV (using MediaFLO, DVBH-H and/or ISDB-T), Wi-Fi and Bluetooth deliver even greater opportunities for device manufacturers to design compelling mobile products that make the promise of constant, seamless connectivity in an extremely thin and small form-factor a reality.
For more information on Snapdragon, please visit: www.cdmatech.com/snapdragon
Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2007 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, including the Company's ability to successfully design and have manufactured significant quantities of Snapdragon-based components on a timely and profitable basis, the extent and speed to which QSD8250 and QSD8650 products are deployed, change in economic conditions of the various markets the Company serves, as well as the other risks detailed from time to time in the Company's SEC reports, including the report on Form 10-K for the year ended September 30, 2007, and most recent Form 10-Q.
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