UMC to fabricate 3G iPhone baseband chip, says paper

United Microelectronics Corporation (UMC) will be the foundry to produce Infineon Technoloiges' 3G baseband chip, which will be used in the new Apple iPhone that supports 3G, according to a Chinese-language Economic Daily News (EDN) report.

The baseband chip (PMB878) will be fabricated on UMC's 65nm process node. Taiwan Semiconductor Manufacturing Company (TSMC) was the foundry partner for Infineon for the baseband chip used in the first-generation iPhone, the paper noted.

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