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T3G not giving up TD-SCDMA solution development

T3G Technology, a China-based TD-SCDMA IC design house, has no plans to give up development of chipset solutions for TD-SCDMA phones, despite reports another China-based TD-SCDMA solution vendor, Commit, has suspended its operations, according to Gary Huang, marketing director, Greater China, NXP Semiconductors.

In addition, T3G is expected to incorporate into the planned wireless joint venture between NXP and STMicroelectronics, and will continue to develop chipset solutions supporting 3G and 4G technologies, Huang stated.

T3G, a joint venture set up jointly by NXP, Datang Mobile, Samsung Electronics and Motorola, has already released TD-SCDMA/EDGE dual-mode and TD-SCEMA/HSDPA/EDGE multi-mode solutions, Huang noted.

Since China-based telecom operator China Mobile has already installed its EDGE networks, T3G's TD-SCDMA/EDGE dual-mode solutions will meet market demand even after China starts implementing its TD-SCDMA service, Huang said.

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