Infineon introduces ultra-low cost dual-SIM integrated on a single platform
Infineon has announced its new ultra-low cost dual-SIM platform. The XMM1028 is based on the X-GOLD102DS and is a cost optimized single baseband solution for dual-SIM platforms. Negating the need for either a second modem on the platform or complex mechanical switching the XMM1028 provides a fully capable dual-SIM solution based on a single baseband device.
The Infineon XMM1028 reference platform comprises of one single chip that integrates baseband, power management, RF and two SIM interfaces. This allows the user to benefit from the offerings of two network operators at the same time, without needing to switch the SIM card. It offers voice call and SMS for both SIM and features unique applications for dual-SIM such as phonebook or call log. It furthermore allows automatically switching between operators.
The XMM1028 platform also needs less than 50 components (modem) in a PCB mounted area of less than six square centimetres and furthermore offers a clean migration path for developers familiar with the XMM1010 platform with fast time-to-market and industries lowest system BOM, which enables manufacturers to offer best possible cost effectiveness in the dual SIM segment.
The X-GOLD102 single chip includes the baseband processor, RF transceiver, RAM memory and the entire power management unit for the mobile phone. It supports MP3 audio (basic multimedia phone), color display, FM radio interface, USB charger and is based on 130nm technology (CMOS SoC) for enhanced monolithic integration.
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The Infineon XMM1028 reference platform comprises of one single chip that integrates baseband, power management, RF and two SIM interfaces. This allows the user to benefit from the offerings of two network operators at the same time, without needing to switch the SIM card. It offers voice call and SMS for both SIM and features unique applications for dual-SIM such as phonebook or call log. It furthermore allows automatically switching between operators.
The XMM1028 platform also needs less than 50 components (modem) in a PCB mounted area of less than six square centimetres and furthermore offers a clean migration path for developers familiar with the XMM1010 platform with fast time-to-market and industries lowest system BOM, which enables manufacturers to offer best possible cost effectiveness in the dual SIM segment.
The X-GOLD102 single chip includes the baseband processor, RF transceiver, RAM memory and the entire power management unit for the mobile phone. It supports MP3 audio (basic multimedia phone), color display, FM radio interface, USB charger and is based on 130nm technology (CMOS SoC) for enhanced monolithic integration.
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