Trehyaderny odnokristalny processor TI
Sometimes, to deal with such a demanding performance targets as simultaneous processing of data on multiple channels or parallel execution of multiple software applications, developers have to deploy several digital signal processors (TSSP) on the same board. Now, thanks to a new multi-vysokoproizvoditelnomu TSSP produced by Texas Instruments Incorporated you can do much save money, energy and space on the motherboard.
TMS320C6474 device combines the three best in the industry processor core TMS320C64x + produced by TI, operating at 1 GHz each. This delivers overall performance TSSP 3 GHz, with the power of the TSSP is reduced by one third and cost - by two thirds compared with discrete processor solutions. C6474 device provides a large integration systems for customers using currently pools TSSP for the end equipment and communications infrastructure, means of obtaining medical imaging, military communications and control of production-based systems technical review.
The device C6474 integrated three-processor core C64x +, each of which operates at a frequency of 1 GHz. This delivers overall performance TSSP at 3 GHz or measured productivity 24000 MMACS (16-bit operation) or 48000 MMACS (8-bit operation). Developers multiprocessor system solutions can now take advantage of high productivity advantages in cost, power consumption and mounting space C6474, as this device is fully compatible with software codes uninuclear TSSP of TI-based kernel C64x + (for example, TMS320C6452, TMS320C6455), as well as processors based on the previous kernel TMS320C64x (for example, a family TMS320C641x). The device C6474 such integration is achieved partly through the use of 65 nm, which allows the use of the shell with an array of spherical conclusions (BGA) 23 x 23 mm, which is comparable in size to existing uninuclear solution for TI TSSP made on 90-nm technology.
TMX320C6474 device will be available for order from the company TI and its authorized distributor in the fourth quarter of 2008 at a cost of 261 U.S. dollar in the amount of installment of 100 pieces. The device comes in the hull 561 BGA measuring 23 x 23 mm. High-performance multi-core C647x, which will in the future, will include six nuclei. Its release is scheduled to announce in the first quarter of 2009.
TMS320C6474 device combines the three best in the industry processor core TMS320C64x + produced by TI, operating at 1 GHz each. This delivers overall performance TSSP 3 GHz, with the power of the TSSP is reduced by one third and cost - by two thirds compared with discrete processor solutions. C6474 device provides a large integration systems for customers using currently pools TSSP for the end equipment and communications infrastructure, means of obtaining medical imaging, military communications and control of production-based systems technical review.
The device C6474 integrated three-processor core C64x +, each of which operates at a frequency of 1 GHz. This delivers overall performance TSSP at 3 GHz or measured productivity 24000 MMACS (16-bit operation) or 48000 MMACS (8-bit operation). Developers multiprocessor system solutions can now take advantage of high productivity advantages in cost, power consumption and mounting space C6474, as this device is fully compatible with software codes uninuclear TSSP of TI-based kernel C64x + (for example, TMS320C6452, TMS320C6455), as well as processors based on the previous kernel TMS320C64x (for example, a family TMS320C641x). The device C6474 such integration is achieved partly through the use of 65 nm, which allows the use of the shell with an array of spherical conclusions (BGA) 23 x 23 mm, which is comparable in size to existing uninuclear solution for TI TSSP made on 90-nm technology.
TMX320C6474 device will be available for order from the company TI and its authorized distributor in the fourth quarter of 2008 at a cost of 261 U.S. dollar in the amount of installment of 100 pieces. The device comes in the hull 561 BGA measuring 23 x 23 mm. High-performance multi-core C647x, which will in the future, will include six nuclei. Its release is scheduled to announce in the first quarter of 2009.
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