Infineon introduced two new RF chip for LTE and 3G networks
German company Infineon Technologies has announced a second-generation chip RF transceiver for embedding in mobile phones that support networks LTE (Long-Term-Evolution), which should replace the third-generation networks. This HF tranchiver called SMARTi LU made on CMOS (CMOS) technology using 65 nm process. Mobile terminals are built using this chip and digital DigRF interface in conjunction with the telephone (Baseband) processor will be able to work in 2G/3G/LTE networks and transfer data at speeds up to 150 Mbps.
In addition, Infineon also announced the third generation of its family of 3G RF transceiver SMARTi UE - SMARTi UEmicro. This chip is optimized for use in low-cost mobile phones with support for two frequency bands WCDMA / EDGE networks. The manufacturer claims that its decision at a cost of $ 6.5 40% lower than similar products that are present now on the market.
In addition, Infineon also announced the third generation of its family of 3G RF transceiver SMARTi UE - SMARTi UEmicro. This chip is optimized for use in low-cost mobile phones with support for two frequency bands WCDMA / EDGE networks. The manufacturer claims that its decision at a cost of $ 6.5 40% lower than similar products that are present now on the market.
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