X-GOLD110: a new generation of chips from Infineon sverhdeshevyh for mobile phones
German company Infineon Technologies AG today presented its new generation of chips for sverhdeshevyh (ULC) mobile phones - X-GOLD110. The manufacturer notes that the chip is the most highly integrated in the world, and very cost effective, odnokristalnoe sverhdeshevyh solution for GSM / GPRS mobile phones. The company also claims that its new solution will reduce system costs manufacturers of phones by 20%.
X-GOLD 110 will serve as the basis for new mobile platforms MM1100, offering the best functionality, while taking up little space on the 4-layer printed circuit board. The new platform supports color displays, play MP3 files, FM radio, charging from the USB, and is ready to connect dvuhsimovyh decisions and cameras.
Infineon assures that XMM1100 help shorten the development cycle of a mobile phone manufacturing companies from one year to 3 - 4 months, thanks to a large number of know-how that are integrated into the platform and a little of the "plug-and-play".
Test samples of X-GOLD110 and XMM1100 will be available in the second quarter of this year, a large-scale production scheduled for the second half of 2009.
X-GOLD 110 will serve as the basis for new mobile platforms MM1100, offering the best functionality, while taking up little space on the 4-layer printed circuit board. The new platform supports color displays, play MP3 files, FM radio, charging from the USB, and is ready to connect dvuhsimovyh decisions and cameras.
Infineon assures that XMM1100 help shorten the development cycle of a mobile phone manufacturing companies from one year to 3 - 4 months, thanks to a large number of know-how that are integrated into the platform and a little of the "plug-and-play".
Test samples of X-GOLD110 and XMM1100 will be available in the second quarter of this year, a large-scale production scheduled for the second half of 2009.
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