Elpida develops 2Gb DDR2 mobile RAM
Elpida Memory has announced it has developed its first 2Gb DDR2 mobile RAM for mobile applications such as smartphones, netbooks and mobile Internet devices (MIDs). Sample shipments are expected to begin in October with the start-up of mass production scheduled for the first half of 2010.
The new 2Gb mobile RAM features the highest density for a JEDEC LPDDR2 (DDR2 Mobile RAM) compatible device, the memory maker claimed.
Elpida said the new chip can operate at 1.2V (conventional DDR Mobile RAM requires 1.8V) while achieving a data transfer rate of 800Mbps (DDR mobile RAM is 400Mbps). Also compared with other same-density and same-speed DDR2 products, as little as 1/16th the power consumption is needed when on standby, making it an eco-friendly DRAM, the company claimed.
The new Elpida device can be shipped as a bare chip for use in system-in-package (SiP), multi-chip package (MCP) and other multi-layer packages, or packaged for a package-on-package (POP) configuration to enable space-saving features, according to the company.
Elpida: Features of 2Gb DDR2 mobile RAM
Item
Description
Product process
50nm CMOS
Data width
x16-bit / x32-bit
Per pin data transfer rate
800Mbps
667Mbps
Supply voltage
VDD1: 1.8V, VDD2/VDDCA/VDDQ: 1.2V
Operating temperature range (TC)
-25 to 85°C (standard),
-25 to 105°C (extended temperature range)
Shipment configuration
Bare chip (JEDEC compatible)
168-ball PoP-type FBGA (JEDEC compatible)
216-ball PoP-type FBGA (JEDEC compatible)
The new 2Gb mobile RAM features the highest density for a JEDEC LPDDR2 (DDR2 Mobile RAM) compatible device, the memory maker claimed.
Elpida said the new chip can operate at 1.2V (conventional DDR Mobile RAM requires 1.8V) while achieving a data transfer rate of 800Mbps (DDR mobile RAM is 400Mbps). Also compared with other same-density and same-speed DDR2 products, as little as 1/16th the power consumption is needed when on standby, making it an eco-friendly DRAM, the company claimed.
The new Elpida device can be shipped as a bare chip for use in system-in-package (SiP), multi-chip package (MCP) and other multi-layer packages, or packaged for a package-on-package (POP) configuration to enable space-saving features, according to the company.
Elpida: Features of 2Gb DDR2 mobile RAM
Item
Description
Product process
50nm CMOS
Data width
x16-bit / x32-bit
Per pin data transfer rate
800Mbps
667Mbps
Supply voltage
VDD1: 1.8V, VDD2/VDDCA/VDDQ: 1.2V
Operating temperature range (TC)
-25 to 85°C (standard),
-25 to 105°C (extended temperature range)
Shipment configuration
Bare chip (JEDEC compatible)
168-ball PoP-type FBGA (JEDEC compatible)
216-ball PoP-type FBGA (JEDEC compatible)
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