6/22/16

Huawei Launches New-Generation HPC Solution at ISC 2016

The International Supercomputing Conference 2016 (ISC16) was held at Messe Frankfurt from June 20 to 22. Huawei, a leading global information and communications technology (ICT) solutions provider, unveiled its new-generation high-performance computing (HPC) solution positioned for intelligent industrial manufacturing, smart education, and scientific research. Huawei demonstrates its progress in developing HPC solutions that feature high efficiency, acceleration, and convergence.

Francis Lam, Huawei IT domain senior expert and HPC solution management director, attended ISC16 and delivered the keynote speech entitled "Innovations Simplify HPC" at the opening ceremony. He said "As new IT technologies such as big data, cloud computing, and deep learning arise and become widespread, market requirements for computing resources are increasing sharply, lending unprecedented vitality to high-performance computing. Leveraging continuous chip, engineering, architecture, and application innovation and excellent IT product design and R&D capabilities, Huawei provides customers with a variety of advanced IT infrastructure products such as servers, storage, and networking devices, helping customers build efficient and accelerated HPC platforms."

Huawei, as a golden sponsor of ISC16, showcased a supercomputing high-performance server supporting up to 32 processors per node, blade server supporting 100Gbps high-speed networks, NVMe SSD delivering high IOPS, and liquid cooling server adopting the warm water cooling technology that allows the cooling water with a temperature as high as 45ºC. The supercomputing solution based on Huawei KunLun 9016/9032 and FusionServer 8100 servers offers an up to 24 TB ultra-large memory capacity and a 2184 GB/s high memory bandwidth, meeting stringent I/O bandwidth requirements for large-scale computing.

Huawei also launched blade server FusionServer E9000 that supports the InfiniBand EDR 100 Gbit/s switching technology. E9000 works with ES3000 SSDs that deliver the highest performance in the industry to build a computing-intensive solution for performance acceleration. In addition, Huawei launched an efficient liquid-cooling solution to reduce energy consumption of large HPC clusters. Leveraging the 45ºC warm water cooling technology and a modular manifold design, a single liquid-cooling cabinet can support up to 128 2-socket compute nodes. A data center adopting the solution can achieve a cooling power usage effectiveness (PUE) of 1.1 or less. Built on meticulous component selection and rigorous system-level integration testing, the solution ensures long-term stable and reliable operating of the liquid-cooling system.

Huawei's HPC service has been warmly embraced by the European market in recent years, especially in industrial manufacturing, education and scientific research domains. Huawei has successfully deployed multiple large HPC clusters for the world's top-class vehicle manufacturers and scientific research institutions. Jeff Jiang, Director of IT Solution, Huawei West European Enterprise Business, also attended the conference. At the event, he said: "Huawei continuously focuses on ICT infrastructure and has been able to build its HPC ecosystem by being open and collaborative. Through close collaboration with local integrators and partners, Huawei provides European customers such as Poland, Poznan Supercomputing and Networking Center (PSNC), with end-to-end HPC solutions and professional project implementation and service capabilities." ISC is one of the world's oldest and most important international HPC conferences. The conference this year focuses on HPC technology convergence and development in big data, cloud computing, and deep learning. With 160 exhibitors, the conference is expected to attract over 3,000 attendees.

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