Hello, Chips! Chapter 14] The Final Process To Complete The Semiconductor! Semiconductor Packaging Technology and TSV Chew!

[ Eng. ver ]

Completion of semiconductors? It depends on packaging. [01:18]

Packaging is the last step of the eight major stages of semiconductor fabrication.
Many people may think that it is a simple packaging, but it is actually an important technology that enables semiconductors to function properly after they are released.
Let’s find out about the packaging.

Importance of the packaging technology. [02:18]

Packaging also enhances the performance of semiconductors.
Thus, it requires advanced technology.
But in the past, packaging only needed to be sturdy enough to protect the semiconductors.
How and why did the packaging, which used to be regarded as a mere postprocess, become an important step that enhances performance

The most cutting-edge packaging technology, TSV. [07:10]

It is the developers’ responsibility to enable various chips to function perfectly and to reduce the volume of the packaging as much as possible.
For the first time in the industry, Samsung Electronics succeeded in this daunting task.
The aggregation of the most cutting-edge packaging technologies, TSV.
The key of the TSV is to interconnect, with a pinpoint accuracy, 60,000 electrical paths, each one of which is one-twentieth of the thickness of a strand of human hair.
Did aliens develop this technology?
Let’s find out about its secret in the 14th episode of “Hello, Chips!”