FPCB makers upbeat about demand from smartphone market
Taiwan flexible printed circuit board (FPCB) makers expect strong demand from the smartphone market in 2009, as High Tech Computer (HTC), Research In Motion (RIM), Palm and Appls will launch new models in the second quarter, according to industry sources in Taiwan.
Taiwan-based Chi Mei Communication Systems will undertake OEM production of the Palm Pre, Palm's next-generation smartphone that will be launched soon. Chi Mei is likely to source handset FPCBs from fellow suppliers, including Career Technology, Ichia Technologies and Flexium Interconnect, with shipments expected to begin in March at the earliest, indicated the sources.
Taiwan-based Chi Mei Communication Systems will undertake OEM production of the Palm Pre, Palm's next-generation smartphone that will be launched soon. Chi Mei is likely to source handset FPCBs from fellow suppliers, including Career Technology, Ichia Technologies and Flexium Interconnect, with shipments expected to begin in March at the earliest, indicated the sources.
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